Marketing Action Plan 2019 [PDF]
Marketing Action Plan 2019
Marketing Action Plan 2019
The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
3D Printed Timing Belts [PDF]
Computer Games as a Future of Manufacturing Education
Geo Technologies Applied to Manufacturing
David Dornfeld Manufacturing Vision Award 2021 Runner-Up
David Dornfeld Manufacturing Vision Award 2021 Finalist
David Dornfeld Manufacturing Vision Award 2021 Finalist