Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
A Message from SME Leadership
The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
SME College of Fellows Previous Winners
Outstanding Young Manufacturing Engineer Award Recipients
RAPID + TCT 22 Enhanced Digital Booth [PDF]
Exhibitor Before After Hours Exhibit Space Function Request Form [PDF]